CPG NexGen Awards

Recognizing the Next Generation of Packaging & Processing Leaders

The 1st annual CPG NexGen Awards honor 10 exceptional young professionals from consumer packaged goods (CPG)/end-user companies who are making an impact in packaging and processing today and helping shape where the industry goes next.

These emerging leaders are innovators, problem solvers and forward thinkers whose work is driving progress across their organization and the broader industry. The CPG NexGen Awards celebrate their achievements, elevate their visibility and recognize the important role young talent plays in the future of packaging and processing.

Introducing the 2026 CPG NexGen Awards Winners

Meet the future of packaging and processing. PMMI is proud to celebrate the inaugural class of CPG NexGen Award winners—10 outstanding young professionals making an impact across the consumer packaged goods industry. Through innovative thinking, leadership, and fresh perspectives, these rising stars are helping shape what’s next for manufacturing.

Ann-Marie Willis

Sr. Engineer, NPD Operations
Mary Kay Global

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Supradeep Vankayala

Lead Design Engineer, R&D
Becton Dickinson

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Scott Turner

Senior Engineer, Packaging
Edwards Lifesciences

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Chad Sienknecht

Production Manager
Trisco Foods LLC

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Hannah de Rosmini

Engineer III
Tyson Foods

Raianna O'Toole

Global Packaging Innovation Lead
Kenvue

Allie Helton

Director of Operations
Wyandot Snacks

Matt J. Fitzpatrick

Packaging Engineering Manager
Saint-Gobain

Hayden Bivens

Packaging Engineer
Frito Lay

Charlotte Ashcraft

Senior Manager, Packaging & Graphics Development
Just Born Quality Confections

Award Winner Experience

Honorees will receive a fully hosted, VIP experience at PACK EXPO International, including:
•  Complimentary registration to PACK EXPO International (Oct. 18-21, 2026)
•  Roundtrip airfare to Chicago + 3-night hotel stay
•  Access to the First-Time Attendee Lounge with daily sessions on how to maximize time at the show
•  Invitation to the Young Professionals Networking Event (Sunday, October 18)
•  Complimentary ticket and recognition at PACK gives BACK™ (Monday, October 19)
•  Private show floor tour with fellow award winners
•  On-site digital signage recognition throughout the show
•  Recognition in a PMMI press release  

OTHER PACK EXPO SHOWS

April 12—14, 2027
Atlanta, GA USA
June 8—10, 2027
Guadalajara, Jal. MX
Sept 27—29, 2027
Las Vegas, NV USA
March 21—23, 2028
Philadelphia, PA USA
June 6—9, 2028
Mexico City, CDMX MX
© 2026 PMMI, The Association for Packaging and Processing Technologies
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