2016 Student Engagement Opportunities

Students and professors from colleges and technical schools with packaging programs come to PACK EXPO International to learn from exhibitors and attendees through great programs such as:


The Amazing Packaging Race

Sponsored by: ASCO

Wednesday, November 9, concluding at the ASCO Booth, North Building, N-5345

Future engineers race on the show floor to complete tasks at the booths of participating exhibitors. This fun and educational event for university students exposes students to the possibilities the industry has to offer.

 View Participating Exhibitors

Amazing Packaging Race

Future Innovators Robotics Showcase 

Sponsored by: B&R

Located in the Upper North Building, Booth N-4585

Future Innovators Robotics Showcase

Robotics teams from Chicago area high schools bring the robots they’ve built and demonstrate how each works. Come watch these cool demonstrations and feel free to ask questions!

Robotics

NextGEN Networking Fair—Meet the Next Generation of Your Workforce

Sponsored by: B&R

Sunday, November 6, 3:00 pm-5:00 pm
Education & Workforce Development Pavilion at PACK EXPO International
McCormick Place, North Mezzanine

NextGEN Logo

All show attendees and exhibitors are invited and encouraged to come meet and talk with your future workforce—students! 

For more information, contact Stephan Girard, PMMI's Director of Workforce Development at 571-612-3196 or sgirard@pmmi.org.

Student Networking

Clemson University – Consumer Driven Package Design

Sponsored by: Esko Logo

Located in the Upper North Building, Booth N-4543

Clemson U Consumer-Driven Package Design logo

Clemson University’s interactive, insightful and fascinating exhibits exploring the impact of packaging on consumers are a main attraction at co-located PACK EXPO International. 

All show attendees and exhibitors are invited and encouraged to come meet and talk with your future workforce—students! 

Clemson